COB technology has been used widely in recent years

COB (Chip on board) LED technology, differs from traditional LED in that instead of individual SMDs soldered to a circuit board and then mounted to a heat sink; the Wafers or “Wafern” are cut into some hundred small chips, with a thickness of only approx. 250 μm. These tiny small and hardly visible pieces of semiconductor crystal are bonded directly to the aluminum substrate (with a proprietary bonding procedure) allowing for optimum heat dissipation, and solderless fabrication. MCOB Exhibits superior Thermal management compared to DIP or SMD, LED technologies are becoming more common in cob led grow lights and High bay lights. They are cheaper to assemble than multiple single chips and so make products like high bay and grow lights much more affordable than multiple chips.